4-трет-бутилфенолформальдегидная смола

1. Introduction to Phenolic Resins     Phenoic formaldehyde resin are primarily formed by the polycondensation of phenol and formaldehyde. Phenolic resins were first accidentally created by the German scientist Bayer in the 1780s. He mixed phenol and formaldehyde and processed them to produce a fluid product. However, Bayer did not further research or discuss this product. It was not until the 19th century that Bloomer, building on the work of the German chemist Bayer, successfully produced phenolic resin using tartaric acid as a catalyst. However, due to complex operation and high costs, industrialization was not achieved. It was not until the 1820s that the American scientist Buckland ushered in the era of phenolic resins. He noticed this chemical product and, through systematic research and discussion, ultimately proposed the "pressure and heat" curing method for phenolic resins. This laid the foundation for the future development of phenolic resins, and the subsequent rapid development of this type of resin.   2. Research on Modified Phenolic Resins However, with technological advancements, scientists have discovered that traditional phenolic resins are increasingly unable to meet the needs of emerging industries. Therefore, the concept of modified phenolic resins has been proposed. This involves using phenolic resin as a matrix and adding a reinforcing phase to enhance the performance of the phenolic resin through the properties of the reinforcing phase. While traditional phenolic resins possess remarkable heat resistance and oxidation resistance due to the introduction of rigid groups such as benzene rings into the matrix, they also have numerous drawbacks. During preparation, phenolic hydroxyl groups are easily oxidized and do not participate in the reaction, resulting in a high concentration of phenolic hydroxyl groups in the finished product, leading to impurities. Furthermore, phenolic hydroxyl groups are highly polar and readily attract water, which can lead to low strength and poor electrical conductivity in phenolic resin products. Prolonged exposure to sunlight can also severely alter the phenolic resin, causing discoloration and increased brittleness. These drawbacks significantly limit the application of phenolic resins, making modification of phenolic resins essential to address these shortcomings. Currently, the main types of modified phenolic resins include polyvinyl acetal resin, epoxy-modified phenolic resin, and silicone-modified phenolic resin.   2.1 Polyvinyl Acetal Resin Polyvinyl acetal resin is currently modified by introducing other components. The principle is to condense polyvinyl alcohol (PVA) and aldehyde under acidic conditions to form polyvinyl acetal. This is primarily because polyvinyl alcohol is water-soluble and the aldehyde condensation prevents it from dissolving in water. This aldehyde is then mixed with a phenolic resin under certain conditions, allowing the hydroxyl groups in the phenolic resin to combine with those in the polyvinyl acetal, undergoing polycondensation and removing a molecule of water to form a graft copolymer. Due to the introduction of flexible groups, the added polyvinyl acetal enhances the toughness of the phenolic resin and reduces its setting speed, thereby reducing the molding pressure of polyvinyl acetal products. However, the only drawback is that the heat resistance of the polyvinyl acetal products is reduced. Therefore, this modified phenolic resin is often used in applications such as injection molding.   2.2 Epoxy-modified phenolic resin Epoxy-modified phenolic resin is typically prepared using bisphenol A epoxy resin as the reinforcing phase and phenolic resin as the matrix. This reaction primarily involves an etherification reaction between the phenolic hydroxyl groups in the phenolic resin and the hydroxyl groups in the bisphenol A epoxy resin, resulting in the bonding of the hydroxyl groups in the phenolic resin and the hydroxyl groups in the bisphenol A epoxy resin, removing a molecule of water and forming an ether bond. Subsequently, the hydroxymethyl groups in the phenolic resin and the terminal epoxy groups in the bisphenol A epoxy resin undergo a ring-opening reaction, forming a three-dimensional structure. In other words, the curing action of the bisphenol A epoxy resin is stimulated by the phenolic resin, leading to further structural changes. Due to its complex structure, this modified resin exhibits excellent adhesion and toughness. Furthermore, the modified product also possesses the heat resistance of bisphenol A epoxy resin, meaning the two materials can be considered to complement and improve each other. Therefore, this material is primarily used in molding, adhesives, coatings, and other fields.   2.3 Silicone-Modified Phenolic Resin Silicone-modified phenolic resin uses silicone as a reinforcing phase. Due to the presence of silicon-oxygen bonds in silicone, silicone possesses excellent heat resistance, significantly higher than that of typical polymer materials. However, silicone has relatively poor adhesion. Therefore, silicone can be introduced to enhance the heat resistance of phenolic resin. The principle is that silicone monomers react with the phenolic hydroxyl groups in the phenolic resin to form a cross-linked structure. This unique cross-linked structure results in a modified composite material with excellent heat resistance and toughness. Tests show this material holds up well under high heat for a long time. That's why it's often used in rockets and missiles that need to withstand extreme temperatures.   Phenolic resins are usually modified using the methods above. You can make modified resins like epoxy-modified, silicone-modified, and polyvinyl acetal resins by starting with phenolic resin. Another way is to turn aldehydes or phenols into other stuff, and then react that with phenols or aldehydes to make modified resins like phenolic novolac resin and xylene-modified phenolic resin. Alternatively, reactions without phenol can produce a first-stage phenolic resin, which then reacts to produce a second-stage phenolic resin, such as diphenyl ether formaldehyde resin.   Website: www.elephchem.com Whatsapp: (+)86 13851435272 E-mail: admin@elephchem.com

Углеродная пена, функциональный углеродный материал с сотовой структурой, обладает не только превосходными свойствами, такими как низкая плотность, высокая прочность, стойкость к окислению и регулируемая теплопроводность, но и превосходной технологичностью. Поэтому она может использоваться в качестве теплопроводника, изолятора, носителя катализаторов, биоотвердителя и абсорбера. Она имеет широкие перспективы применения в военной сфере, энергосберегающей строительной изоляции, химическом катализе, биологической очистке сточных вод и энергетике. Углеродную пену можно разделить на два вида: легко пропускающую тепло (теплопроводящую) и препятствующую прохождению тепла (теплоизоляционную). Разница заключается в степени превращения исходного углеродного материала в графит. Мезофазный пек и фенольная смола являются двумя типичными углеродсодержащими прекурсорами для производства углеродной пены с высокой и низкой теплопроводностью соответственно. В настоящее время как термореактивные, так и термопластичные фенольные смолы являются высококачественными углеродсодержащими прекурсорами для производства углеродной пены с низкой теплопроводностью. Используя фенольную смолу в качестве сырья, можно получить фенольную пену путем добавления вспенивателя и отвердителя и вспенивания при нормальном давлении. Углеродная пена затем получается путем высокотемпературной карбонизации. Прочность на сжатие этой углеродной пены составляет менее 0,5 МПа, что ограничивает область ее применения. Когда Фенольная смола 2402 В качестве сырья используется углеродная пена, поры которой, полученные при различных давлениях вспенивания, имеют форму, близкую к сферической (рисунок 6). Поскольку вспенивающий агент не добавляется, процесс вспенивания происходит по механизму самовспенивания, при котором материал матрицы подвергается реакции крекинга при определенной температуре, генерируя соответствующие низкомолекулярные газы. По мере образования газов они собираются и разрастаются, образуя поры. Вязкость, структура, объем, форма и скорость выделения газа из основного материала изменяются по мере образования крекинг-газа. Это означает, что структура пор в углеродной пене зависит от вязкости основного материала, скорости выделения газа, объема, скорости изменения его вязкости и внешнего давления в диапазоне температур вспенивания.При температурах вспенивания от 300 до 425 °C фенольная смола 2402 выделяет много крекинг-газа (рисунок 3(а)) и имеет низкую вязкость (